| Layer Count | 1 - 32 Layer Rigid, HDI | |
| Finished Board Thickness | • 0.4 – 7.0mm (> 3.2mm on request) • Tolerance: +/-10% • Core thickness min 0.075mm for inner layer | |
| Base Copper Thickness | • Outer Layer 6oz • Inner Layer 10oz | |
| Max. Production Panel Size | • 600mm x 700mm | |
| Max. PCB size | • 540mm x 660mm | |
| Min. Line Width/ Line Space | • 0.075mm/0.075mm | |
Min. Hole Size (Finished) • Mechanical • Laser | • 0.15mm • 0.1mm | |
Laminate Main Brands: ShengYi, KB, Ventec, ITEQ, Panasonic, Rogers, Wangling & Taconic | CEM-1 CEM-3 CTI ≥600 FR-4 | BT epoxy Metal substrate material |
| Solder Mask Color Main brands: Tamura, Taiyo, OTC, Huntsman | • Green (glossy | semi-matte | matte) • Blue • Black | • White • Red |
| Surface Finish | • HAL (leadfree) • Immersion Nickel Gold • Immersion Tin | • Immersion Silver • OSP • Peel able solder mask • Gold Finger • Carbon Ink Print |
| Profiling | • Routing | Depth Routing Tolerance: • Punching • V-scoring | Jump V-scoring | |
| Additional Technology | • HDI boards (micro via, blind via, buried via) • Resin plugging of via holes, copper plugging of micro via • Press-fit hole | |
| Order Types | Prototypes to mass production | |
| Layer Count | • Rigid-Flex : 2 – 14 layers • Flex: 1 – 10 layers | |
| Finished Board Thickness | • Rigid-Flex : 0.2 – 3.2mm • Flex: 0.15 – 1.0mm | |
| Base Copper Thickness | • Outer Layer 4oz • Inner Layer 4oz | |
| Max. Production Panel Size | • 450X1,000mm (2L) • 450X600mm (ML) | |
| Laminate | • FR-4 • Polyimide | |
| Solder Mask Color Main brands: Taiyo | • Green • Yellow • Amber | • Blue • Black • White |
| Surface Finish | • HAL • HAL LF • Immersion Nickel Gold | • Galvanic Nickel Gold • Immersion Tin • OSP • Immersion Sliver |
| Profiling | • Punching (Mass Production) • Laser Cutting (Samples Production) • Routing (Sample Production) | |
| Stiffener | • PSA(Pressure sensitive adhesive) • TSA(thermal sensitive adhesive) • Materials: FR-4, Aluminum, PI, PET, 3M Tape | |
| Technology | Metal 1-4 Layer & Copper substrate | |
| Finished Board Thickness | • On request | |
| Max. PCB size | • Depending from used material type | |
| Bow & Twist | • 0.7% | |
| Min. Line Width/ Line Space | • 0.1mm | |
| Laminate | • Main brands: Ventec, Laird & BOYU • Aluminum base ( 1-7 /MK)，1-4 layers • Copper base(1-4 layers), 400W/MK | |
Solder Mask Color Main brands: Tamura, Taiyo, OTC & Huntsman | • Green (glossy | semi-matte | matte) • Blue • Black | • White • Red |
| Surface Finish | • HAL (leadfree) • Immersion Nickel Gold • Immersion Tin • Immersion Silver | • OSP |
| Profiling | • Punching (Mass Production) • Laser Cutting (Sample production) • Routing (Sample production) | |
0086-755-23206750
A1-402, Fu Ying 2nd Industrial park, Jian An road, FuHai Sub-District. Bao An District, Shen Zhen, China
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